Research And Development Manager

in Calamba Philippines. g. AutoCAD and Cadence APD)FEA modeling experience for thermal, mechanical and electrical package optimizationAdvanced package development knowledge including WLCSP, Cu pillar bump, SiP packaging, and Cu Clip assemblyExperience in strip testable package development

RESPONSIBILITIES: Identify suitable Panel Level and WLCSP (PLP) package options and perform feasibility studies for all NPI (new product introduction), provide direct interface with material suppliers as well as design groups, product engineering, marketing and business unitsManage qualification of new packages or changes to ensure quality and mitigate riskInitiate or assist with documentation creation, specifications and build instructions for PLP assemblyAssist with global cost reduction, standardization and new system implementation projectsInitiate and develop FMEA and other proactive reliability and process improvement flows MANDATORY SKILLS: Ability to comprehend engineering drawings, design changes, and specifications.

Subject Matter Expert on WLP and PLP technology and processesSuperior communication and presentation skills as well as advanced project managementAbility to solve problems and assist the reliability group on FA’s on assembly related failuresAbility to carry on multiple projects, set timelines and prioritize projectsCompetence in working with multiple databases, technical acronyms and complex data setsSubject matter expert on major process modulesProficient in material and process characterizationProvide technical competitor analysis and review and review of new solutionsKnowledgeable in data analysis, failure isolation, product and design information, device knowledge and deep understanding of our current technologiesProvide technical guidance to junior level engineers.