Process and Equipment Module Engineer (DIE Attach or Thermal Compress Bonding)

Job description

Job Description Owns critical high volume manufacturing equipment and processes that enable rapid device miniaturization and the mass production of integrated circuits. Conducts tests and measurements of operations to ensure control over critical dimensions and defectivity of the process line. Recommends and implements modifications for operating the equipment to improve production efficiencies, manufacturing techniques, and optimizing production output for existing products, to meet safety, quality and cost indicator goals. Grows in‑situ manufacturing capacity to high volumes to demonstrate the technology capability while simultaneously transferring the technology to counterparts in manufacturing sites across the globe. Owns execution of maintenance and repair activities for equipment and relevant modules of components. Initiates and owns the continuous improvement of equipment and process for key performance indicators (e.g., safety, quality, cost, productivity, defects, and yield) and works with equipment suppliers as required. Owns process development line items aligned to high volume process nodes. Participates in the transfer of technology to other sites through training and audit of installation and qualification outcomes to ensure matched processing across sites. Owns development and optimization of excursion prevention systems for the equipment and process. Owns detection of discrepant material or activities of the equipment and process. During factory ramps, owns equipment install/conversion and qualification to ensure tools are installed safely and on schedule, while meeting all quality/matching criteria (from design through Safety Level 1 and Safety Level Supplier milestones, Intel qual and manufacturing readiness processes). Qualifications Bachelor’s degree in Materials/Mechanical/Chemical/Electrical Engineering or related field. At least 2 years hands‑on experience in die attach/TCB, flip‑chip, or semiconductor assembly process. Strong knowledge of Cu pillar/microbump metallurgy, wetting, thermomechanical behavior, and fine‑pitch alignment. Proficiency in SPC and data‑driven problem solving. Experience with metrology analytics (e.g., X‑ray, warpage measurement, optical inspection (AOI), microscopy). Ability to work in Class 10k–100k cleanroom with PPE. Job Type Experienced Hire Shift Shift 1 (Malaysia) Primary Location Malaysia, Kulim Posting Statement All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance. Work Model This role will require an on-site presence. Job posting details (such as work model, location or time type) are subject to change. #J-18808-Ljbffr